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INTEGRATED CIRCUITS
DATA SHEET
74AHC1G14; 74AHCT1G14 Inverting Schmitt trigger
Product specification File under Integrated Circuits, IC06 1999 Aug 05
Philips Semiconductors
Product specification
Inverting Schmitt trigger
FEATURES * Symmetrical output impedance * High noise immunity * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V * Low power dissipation * Balanced propagation delays * Very small 5 pin package * Output capability: standard. APPLICATIONS * Wave and pulse shapers * Astable multivibrators * Monostable multivibrators. DESCRIPTION The 74AHC1G/AHCT1G14 is a high-speed Si-gate CMOS device. The 74AHC1G/AHCT1G14 provides the inverting buffer function with Schmitt-trigger action. These devices are capable of transforming slowly changing input signals into sharply defined, jitter-free output signals. Notes
74AHC1G14; 74AHCT1G14
QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 3.0 ns. TYPICAL SYMBOL tPHL/tPLH CI CPD PARAMETER CONDITIONS AHC1G propagation CL = 15 pF; delay inA to outY VCC = 5 V input capacitance power dissipation CL = 15 pF; capacitance f = 1 MHz; notes 1 and 2 3.2 1.5 12 AHCT1G 4.1 1.5 13 ns pF pF UNIT
1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts. 2. The condition is VI = GND to VCC. FUNCTION TABLE See note 1. INPUT (inA) L H Note 1. H = HIGH voltage level; L = LOW voltage level. OUTPUT (outY) H L
ORDERING INFORMATION PACKAGES TYPE NUMBER 74AHC1G14GW 74AHCT1G14GW TEMPERATURE RANGE -40 to +85 C PINS 5 5 PACKAGE SC-88A SC-88A MATERIAL plastic plastic CODE SOT353 SOT353 MARKING AF CF
1999 Aug 05
2
Philips Semiconductors
Product specification
Inverting Schmitt trigger
PINNING PIN 1 2 3 4 5 n.c. inA GND outY VCC SYMBOL not connected data input ground (0 V) data output DC supply voltage
74AHC1G14; 74AHCT1G14
DESCRIPTION
handbook, halfpage
n.c 1 inA 2 GND 3
MNA022
5 VCC
handbook, halfpage
14
4 outY
2
inA
outY
4
MNA023
Fig.1 Pin configuration.
Fig.2 Logic symbol.
handbook, halfpage
2
MNA024
4
handbook, halfpage
inA
outY
MNA025
Fig.3 IEC logic symbol.
Fig.4 Logic diagram.
1999 Aug 05
3
Philips Semiconductors
Product specification
Inverting Schmitt trigger
RECOMMENDED OPERATING CONDITIONS
74AHC1G14; 74AHCT1G14
74AHC1G SYMBOL VCC VI VO Tamb PARAMETER DC supply voltage input voltage output voltage operating ambient temperature see DC and AC characteristics per device CONDITIONS MIN. 2.0 0 0 -40 TYP. 5.0 - - +25 MAX. 5.5 5.5 VCC +85 MIN. 4.5 0 0 -40
74AHCT1G UNIT TYP. 5.0 - - +25 MAX. 5.5 5.5 VCC +85 V V V C
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC VI IIK IOK IO ICC Tstg PD Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 55 C the value of PD derates linearly with 2.5 mW/K. PARAMETER DC supply voltage input voltage range DC input diode current DC output diode current DC output source or sink current DC VCC or GND current storage temperature power dissipation per package temperature range: -40 to +85 C; note 2 VI < -0.5 V VO < -0.5 V or VO > VCC + 0.5 V; note 1 -0.5 V < VO < VCC + 0.5 V CONDITIONS MIN. -0.5 -0.5 - - - - -65 - MAX. +7.0 +7.0 -20 20 25 75 +150 200 UNIT V V mA mA mA mA C mW
1999 Aug 05
4
Philips Semiconductors
Product specification
Inverting Schmitt trigger
DC CHARACTERISTICS
74AHC1G14; 74AHCT1G14
Family 74AHC1G Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VOH HIGH-level output voltage; all outputs VI = VIH or VIL; IO = -50 A VI = VIH or VIL; IO = -4.0 mA VI = VIH or VIL; IO = -8.0 mA VOL LOW-level output voltage; all outputs VI = VIH or VIL; IO = 50 A VI = VIH or VIL; IO = 4.0 mA VI = VIH or VIL; IO = 8.0 mA II ICC CI input leakage current quiescent supply current input capacitance VI = VCC or GND VCC (V) 2.0 3.0 4.5 HIGH-level output voltage 3.0 4.5 2.0 3.0 4.5 LOW-level output voltage 3.0 4.5 5.5 MIN. 1.9 2.9 4.4 2.58 3.94 - - - - - - - - 25 TYP. 2.0 3.0 4.5 - - 0 0 0 - - - - 1.5 MAX. - - - - - 0.1 0.1 0.1 0.36 0.36 0.1 1.0 10 Tamb (C) -40 to +85 MIN. 1.9 2.9 4.4 2.48 3.8 - - - - - - - - MAX. - - - - - 0.1 0.1 0.1 0.44 0.44 1.0 10 10 A A pF V V V V UNIT
VI = VCC or GND; 5.5 IO = 0
1999 Aug 05
5
Philips Semiconductors
Product specification
Inverting Schmitt trigger
74AHC1G14; 74AHCT1G14
Family 74AHCT1G Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VOH HIGH-level output voltage; all outputs VI = VIH or VIL; IO = -50 A VCC (V) 4.5 4.5 4.5 4.5 5.5 5.5 5.5 MIN. 4.4 3.94 - - - - - 25 TYP. 4.5 - 0 - - - - MAX. - - 0.1 0.36 0.1 1.0 1.35 Tamb (C) -40 to +85 MIN. 4.4 3.8 - - - - - MAX. - - 0.1 0.44 1.0 10 1.5 V V V V A A mA UNIT
HIGH-level output voltage VI = VIH or VIL; IO = -8.0 mA VOL LOW-level output voltage; VI = VIH or VIL; all outputs IO = 50 A LOW-level output voltage II ICC ICC input leakage current quiescent supply current additional quiescent supply current per input pin input capacitance VI = VIH or VIL; IO = 8.0 mA VI = VIH or VIL VI = VCC or GND; IO = 0 VI = 3.4 V; other inputs at VCC or GND; IO = 0
CI
-
1.5
10
-
10
pF
1999 Aug 05
6
Philips Semiconductors
Product specification
Inverting Schmitt trigger
TRANSFER CHARACTERISTICS
74AHC1G14; 74AHCT1G14
Type 74AHC1G14 Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER VT+ positive-going threshold see Figs 7 and 8 VCC (V) 3.0 4.5 5.5 VT- negative-going threshold see Figs 7 and 8 3.0 4.5 5.5 VH hysteresis (VT+ - VT-) see Figs 7 and 8 3.0 4.5 5.5 MIN. - - - 0.9 1.35 1.65 0.3 0.4 0.5 - - - - - - - - - 25 TYP. MAX. 2.2 3.15 3.85 - - - 1.2 1.4 1.6 - - - 0.9 1.35 1.65 0.3 0.4 0.5 Tamb (C) -40 to +85 MIN. MAX. 2.2 3.15 3.85 - - - 1.2 1.4 1.6 V V V UNIT
Type 74AHCT1G14 Over recommended operating conditions; voltage are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VT+ VT- VH positive-going threshold negative-going threshold hysteresis (VT+ - VT-) see Figs 7 and 8 see Figs 7 and 8 see Figs 7 and 8 VCC (V) 4.5 5.5 4.5 5.5 4.5 5.5 MIN. - - 0.5 0.6 0.4 0.4 - - - - - - 25 TYP. MAX. 2.0 2.0 - - 1.4 1.6 - - 0.5 0.6 0.4 0.4 Tamb (C) -40 to +85 MIN. MAX. 2.0 2.0 - - 1.4 1.6 V V V UNIT
1999 Aug 05
7
Philips Semiconductors
Product specification
Inverting Schmitt trigger
AC CHARACTERISTICS Type 74AHC1G14 GND = 0 V; tr = tf 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VCC = 3.0 to 3.6V; note 1 tPHL/tPLH propagation delay inA to outY see Figs 5 and 6 15 pF 50 pF - - - - 4.2 6.0 CL MIN.
74AHC1G14; 74AHCT1G14
Tamb (C) 25 TYP. MAX. -40 to +85 MIN. MAX. UNIT
12.8 16.3
1.0 1.0
15.0 18.5
ns ns
VCC = 4.5 to 5.5 V; note 2 tPHL/tPLH propagation delay inA to outY see Figs 5 and 6 15 pF 50 pF 3.2 4.6 8.6 10.6 1.0 1.0 10.0 12.0 ns ns
Notes 1. Typical values at VCC = 3.3 V. 2. Typical values at VCC = 5.0 V. Type 74AHCT1G14 GND = 0 V; tr = tf 3.0 ns. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS VCC = 4.5 to 5.5 V; note 1 tPHL/tPLH propagation delay inA to outY see Figs 5 and 6 15 pF 50 pF - - 4.1 5.9 7.0 8.5 1.0 1.0 8.0 10.0 ns ns CL MIN. 25 TYP. MAX. Tamb (C) -40 to +85 MIN. MAX. UNIT
Note 1. Typical values at VCC = 5.0 V.
1999 Aug 05
8
Philips Semiconductors
Product specification
Inverting Schmitt trigger
AC WAVEFORMS
74AHC1G14; 74AHCT1G14
handbook, halfpage
inA INPUT
VM(1)
handbook, halfpage
VCC VI D.U.T. RT CL
MNA101
tPHL
tPLH
PULSE GENERATOR
VO
outY OUTPUT
VM
(1)
MNA033
FAMILY AHC1G AHCT1G Fig.5
VI INPUT REQUIREMENTS GND to VCC GND to 3.0 V
VM INPUT 1.5 V
VM OUTPUT 50% VCC
Definitions for test circuit: CL = Load capacitance including jig and probe capacitance. (See Chapter "AC characteristics" for values). RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
50% VCC 50% VCC
The input (inA) to output (outY) propagation delays.
Fig.6 Load circuitry for switching times.
TRANSFER CHARACTERISTIC WAVEFORMS
handbook, halfpage
VO
handbook, halfpage
VI
VT+ VT-
VH
VO VH VT+ VT-
MNA026 MNA027
Fig.7 Transfer characteristic.
Fig.8 The definitions of VT+, VT- and VH.
1999 Aug 05
9
Philips Semiconductors
Product specification
Inverting Schmitt trigger
74AHC1G14; 74AHCT1G14
handbook, halfpage
1.5
MNA401
MNA402
handbook, halfpage
5 I CC
I CC (mA) 1
(mA) 4
3
2 0.5 1
0 0 1 2 VI (V) 3
0 0 1 2 3 4 V (V) 5 I
Fig.9
Typical AHC1G14 transfer characteristics; VCC = 3.0 V.
Fig.10 Typical AHC1G14 transfer characteristics; VCC = 4.5 V.
handbook, halfpage
8
MNA403
MNA404
handbook, halfpage
I CC (mA) 6
5 I CC (mA)
4
3 4 2 2 1
0 0 2 4 VI (V) 6
0 0 1 2 3 4 V (V) 5 I
Fig.11 Typical AHC1G14 transfer characteristics; VCC = 5.5 V.
Fig.12 Typical AHCT1G14 transfer characteristics; VCC = 4.5 V.
1999 Aug 05
10
Philips Semiconductors
Product specification
Inverting Schmitt trigger
74AHC1G14; 74AHCT1G14
APPLICATION INFORMATION The slow input rise and fall times cause additional power dissipation, this can be calculated using the following formula: Pad = fi x (tr x ICC(AV) + tf x ICC(AV)) x VCC where: Pad = additional power dissipation (W); fi = input frequency (MHz); tr = input rise time (ns); 10% to 90%; tf = input fall time (ns); 90% to 10%; ICC(AV) = average additional supply current (A). Average ICC differs with positive or negative input transitions, as shown in Figs 14 and 15. AHC1G/AHCT1G14 used in relaxation oscillator circuit, see Fig.16.
handbook, halfpage
8
MNA405
I CC (mA) 6
4
2
0 0 2 4 VI (V) 6
Note to the application information: 1. All values given are typical unless otherwise specified.
Fig.13 Typical AHCT1G14 transfer characteristics; VCC = 5.5 V.
handbook, halfpage
200
MNA036
handbook, halfpage
200
MNA058
ICC(AV) (A) 150 positive-going edge 100
ICC(AV) (A) 150 positive-going edge
100
50
50 negative-going edge
negative-going edge
0 0 2.0 4.0 VCC (V) 6.0
0 0 2 4 VCC (V) 6
Fig.14 Average ICC for AHC1G Schmitt-trigger devices; linear change of VI between 0.1VCC to 0.9VCC.
Fig.15 Average ICC for AHCT1G Schmitt-trigger devices; linear change of VI between 0.1VCC to 0.9VCC.
1999 Aug 05
11
Philips Semiconductors
Product specification
Inverting Schmitt trigger
74AHC1G14; 74AHCT1G14
handbook, halfpage
R
C
MNA035
For AHC1G:
1 1 f = -- -------------------------T 0.55 x RC 1 1 f = -- -------------------------T 0.60 x RC
For AHCT1G:
Fig.16 Relaxation oscillator using the AHC1G/AHCT1G14.
1999 Aug 05
12
Philips Semiconductors
Product specification
Inverting Schmitt trigger
PACKAGE OUTLINE Plastic surface mounted package; 5 leads
74AHC1G14; 74AHCT1G14
SOT353
D
B
E
A
X
y
HE
vMA
5
4
Q
A
A1
1
e1 e
2
bp
3
wM B detail X Lp
c
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.1 bp 0.30 0.20 c 0.25 0.10 D 2.2 1.8 E (2) 1.35 1.15 e 1.3 e1 0.65 HE 2.2 2.0 Lp 0.45 0.15 Q 0.25 0.15 v 0.2 w 0.2 y 0.1
OUTLINE VERSION SOT353
REFERENCES IEC JEDEC EIAJ SC-88A
EUROPEAN PROJECTION
ISSUE DATE 97-02-28
1999 Aug 05
13
Philips Semiconductors
Product specification
Inverting Schmitt trigger
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
74AHC1G14; 74AHCT1G14
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1999 Aug 05
14
Philips Semiconductors
Product specification
Inverting Schmitt trigger
74AHC1G14; 74AHCT1G14
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable suitable suitable suitable suitable suitable REFLOW(1)
1999 Aug 05
15
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For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1999
Internet: http://www.semiconductors.philips.com
SCA 67
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
245002/01/pp16
Date of release: 1999
Aug 05
Document order number:
9397 750 05741

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